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MEMS-CastingTM Technical introduction

MEMS-CastingTM technology is a wafer-level fast thick metal forming process. Based on MEMS, microfluidics, microscopic effects of surface tension, and nano-molecular layers, this technology can rapidly form structured metals on silicon wafers, glass sheets, and ceramic sheets. Floor. Copper plating is currently the only way to achieve thick metal on a wafer. This technology is an alternative and complement to electroplating technology. Compared to copper plating, micro-molding technology has the following advantages:

  1. The whole process is a physical process, without using any chemicals.
  2. Filling/forming is extremely efficient and takes only a few minutes.
  3. More complex structures, such as spiral inductors, can be formed at one time.
  4. The process is simpler and requires no seed layer, further reducing process costs.
  5. The whole process is environmentally friendly and non-polluting, and does not produce any industrial waste gas/liquid.
  6. A variety of alloy materials are available to meet the needs of different applications. Special alloy materials require custom development.
  • Compared with electroplating deposition technology

  MEMS-CastingTM technology Plating fill
Pre-processing No seed layer required, simple process Seed layer before filling
Filling process
  1. Pure physical effects, taking advantage of the surface tension of liquids on the micrometer scale.
  2. Fast, the process takes only a few minutes.
  3. It has no selectivity to the through hole diameter and can fill the through holes of different apertures at the same time.
  4. Complex three-dimensional structures can be batch formed at one time.
  1. Complex chemical processes are essentially atomic depositions.
  2. It takes several hours to several tens of hours depending on the pore size of the filled pores.
  3. Only through holes of the same aperture can be filled.
Material / environmental protection
  1. Use non-toxic alloy materials such as tin, silver and indium.
  2. The material cost is low, and only the amount of the filled pore volume is used at a time, and the amount is very small.
  1. The plating solution has certain toxicity and is prone to heavy metal pollution.
  2. The cost of the plating solution is high, and the use of additives such as inhibitors and accelerators further increases the cost.
Conductive properties The electrical conductivity of the alloy is weaker than that of copper. Copper plating has good conductivity